DCP01/50 (50 separated chips), 1190,00 €
DCP01/15 (15 separated chips), 420,00 €

Coating Specification:

  • Thickness of diamond coating is about 100 nm.
  • Diamond coating is doped with nitrogen.
  • Film resistivity: 0,5-1 Ohm*cm.
  • Tip curvature radius after coating is about 100 nm.
  • Recommended for electrical modes.
  • Specially recommended for Electrical AFM modes (EFM, SCM, SKM, SRM etc).

Probe specification

  • Standard chip size: 1.6x3.6x0.4 mm.
  • High cemically stable reflective Au coating (reflective property is 3 times better in comparison with uncoated cantilevers).
  • Typical curvature radius of a tip: 100 nm.
  • Tip height: 10 - 15 µm.
  • Each chip has one RECTANGULAR spring.
  • Compatible with the most commercial SPM devices.
  • Silicon is doped by boron with the concentration about 5x1020 cm-3 to avoid electrostatic charges.
  • Packaged in GelPak® boxes.

GelPak® is a registered trade mark of Vichem Corporation.

Specification for DCP01 series
Chip thickness 0.4 mm
Reflective side Au
Spring number 1 rectangular
Aspect ratio 3:1
Cone angle j <=22°
Curvature radius of a tip typical 100 nm
Available Cantilever series Cantilever length, L±5µm Cantilever width, W±3µm Cantilever thickness, µm Resonant frequency, kHz Force constant, N/m
min typical max min typical max min typical max
DCP01 130 35 1.7 2.0 2.3 115 150 190 2.5 5.5 10